With high technology and intelligent processes, the Cromatek is reference in the PCB assembly for industries. Count on our experts to turn your projects into reality.
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Montagem SMT - Surface Mounting Technology - Montagem que utiliza componentes SMD (Surface Mounting Devices)
SMT assembly lines are composed of state-of-the-art equipment, providing the highest precision and stability in the process, thus ensuring strict quality control.
Through Hole Technology - Pin Through Hole
Excellence in THT assembly with automated processes, Kaizen methodology, Lean Manufacturing and axial, radial, jumpers and special component insertion capabilities.
Over 6.000m² structure
A Cromatek meets large demands for assembly THT and SMT with excellence, has a capacity of 90,000 CPH, ESD clean room, line Integration of final products, PPB (basic production process) and all necessary testing equipment. Commitment to quality, deadline and especially to you, our customer!
Why Choose Cromatek PCB Assembly
PCB Assembly Lines
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Component Inspection Equipment and PCB
|Equipment Description||Model||Manufacturer||Assembly capacity||Accuracy||Calibration Frequency|
|MDA Tester||TRI-518F||TRI||90 paineis / hora||1,00%||NA|
|Various functional jigs||NA||Cromatek||Depends on the product||Depends on the product||Validated by standard board|
|In-Circuit Tester - ICT (will be rented for this project)||3272||Agilent||>60 paíneis/h||Equipamento definido por CTMSP; Fixture e Programação fornecidos por CTMSP||Half-yearly according to manufacturer|
|Automatic Optical Inspector - AOI (will be rented for this project)||BX||Nordson YESTECH||>60 paíneis/h||point size 8 microns||Will be rented already calibrated|
PTH and SMT Mounting Equipment
|Equipment Description||Model||Manufacturer||Assembly capacity||Accuracy|
|SMD assembly machine||FX1-R||JUKI||33.000 comp/hora||±0.05 mm (Cpk >=1)|
|SMD assembly machine||FX1R||JUKI||33.000 comp/hora||±0.05 mm (Cpk >=1)|
|SMD assembly machine||2080 L||JUKI||16.800 comp/hora||±0.03 mm (Cpk >=1)|
|Solder paste or semi-automatic adhesive printing||MPM AP EXEL||MPM||< 6 seg cycle time||+/- 25 microns (+/- 0.001”) at 6 sigma|
|Refusion oven 10 zones||Flow Convect 10||Electrovert||Depends on belt speed and board size||+/- 1 C temp; +/- 1 cm/min velocidade|
|Wave soldering machine, double wave, tin lead||Compact 250||Prosolder||Depends on belt speed and board size||+/- 1 C temp; +/- 1 cm/min velocidade|
|Wave soldering machine, double wave, lead free||V-Soltes||WS-350PC-LF||Depends on belt speed and board size||+/- 1 C temp; +/- 1 cm/min velocidade|
PCB Assembly Line Machines
PCB Laser marking: 2D code with MTA codification is mandatory for every PCB – internal codification system will be shared (18 characters 5x5mm data matrix code: 10CHR code, 3CHR batch number, 5 CHR serial number) PCB cleaning: necessary to have roll system for dust cleaning before screen printing machine.
Solder paste printing: we don’t need the supplier use our own solder paste model, but is necessary to share model/type it wants to use and internal qualification done.
SPI: necessary 100% of PCB pads inspection on 100% of parts produced. Result must be recorded and linked to PCB serial number.
SMD placement: error proofing need to be guaranteed for component placement and set-up reel feeding.
Reflow: recording of solder profile is not mandatory, but it’s important to share profile qualification and periodical verification of the oven (at least once a month).
AOI: 3D is nice-to-have, in case of 2D the supplier need to prove that the test is compliant to detect all errors with MSA study.
ICT: due to high volumes and relays pre-functional test, is necessary to have bed-of-nail fixture on ICT machine and supplier must share complete coverage matrix.
The PBCA must be delivered to MTA in panel (no depaneling required) 100% good in proper package. No X-out allowed.
PTH to SMD Upgrade
Did you know that it is possible to convert a PCB with PTH components to one with SMD components? Our engineers can do a study to make this project possible and modernize your product.
As printed circuit boards with SMT assembly and SMD components have a high standard of quality and finish, the manufacturing process is much more precise than PTH, with PTH components and when the technology conversion takes place, even the PCB benefits from the reduced size.
A assembly of SMD electronic boards is more precise as it is made electronically, without human interference, after millimeter insertion of the components, the printed circuit board goes to the reflow oven, with 5 microprocessed zones that melt the solder paste (which can be with or without lead) thus fixing the components to the PCB, without the need to drill the PCB.
Step by Step for PCB Assembly
There is no standard printed circuit board. Each PCB has a unique function for a specific product. Therefore, producing a PCB is a complex multi-step process. This overview covers the most important steps when producing a multi-layer PCB.
Hiring the PCB assembly with the Cromatek is premised to have the control of all stages of the production line according to the specifications of the project ensuring that the product meets what it promises.
01 – Project Engineering
The data provided by the customer (gerber) is used to produce the manufacturing data for the specific PCB (circuit design for imaging and drilling data). Engineers compare demands / specifications with resources to ensure compliance and also determine the process steps and associated checks.
02 – Prepare the phototools
The Artwork Master is the production of PCBs in the main steps, which directly affect the quality of the final product. Artwork Master - The photographic image of the PCB standard on the film used to produce the circuit board, usually on a scale of 1: 1.
In general, there are three types of artwork master:
(1) conductive standard;
(2) solder mask;
(3) screen printing.
03 - Printing inner layers
Stage 1 is to transfer the image using an art film to the surface of the plate, using photosensitive dry film and UV light, which will polymerize the dry film exposed by the artwork. This step of the process is performed in a clean room. Image - The process of transferring electronic data to the photo plotter, which in turn uses light to transfer a negative image circuit pattern to the panel or film.
04 - Etch inner layers
Stage 2 is removing the unwanted copper from the panel using the recording. After this copper is removed, the rest of the dry film is removed, leaving behind the copper circuit that matches the design. Engraving - The chemical, or chemical and electrolytic, removal of unwanted parts of conductive or resistive material.
05 - Automatic internal layer optical inspection (AOI)
Inspection of circuits against digital "images" to verify that the circuits correspond to the design and are free of defects. Achieved by scanning the board and then trained inspectors will check for any anomalies highlighted in the scanning process. PCBWay Group does not allow open circuit repair.
06 - Lay-up and gluing (Lamination)
The inner layers have an applied oxide layer and are then "stacked" together with the pre-preg, providing insulation between the layers and the copper sheet on top and bottom of the stack. The lamination process consists of placing the inner layers under extreme temperatures (375 degrees Fahrenheit) and pressure (275 to 400 psi) while laminating with a photoresist dry resistance. The PCB can cure at high temperature, the pressure is released slowly and the material is cooled slowly.
07 - Drilling the PCB for electronic board assembly
Now we have to drill the holes that will later create electrical connections within the multi-layer PCB. This is a mechanical drilling process that must be optimized so that we can get a record of all the connections within the inner layer. The panels can be stacked in this process. Drilling can also be done with a laser drill.
08 - Electrolyte-free copper deposition
The first step in the galvanization process is the chemical deposition of a very thin layer of copper on the walls of the holes. PTH provides a very thin copper deposit that covers the wall of the hole and the complete panel. A complex chemical process that must be strictly controlled to allow a reliable copper deposit to be coated even on the wall of the non-metallic borehole. Although there is not enough copper on its own, we now have electrical continuity between the layers and through the holes. The panel lining follows in PTH to provide a thicker copper tank over the PTH tank - normally 5 to 8 one. The combination is used to optimise the amount of copper to be coated and engraved in order to meet the demands of strip and clearance.
09 - Image of the outer layers
Similar to the process of the inner layer (image transfer using photosensitive dry film, UV exposure and recording), but with one main difference - we will remove the dry film where we want to keep the copper / define the circuits - so that we can plug copper later in the process.
This process step is performed in a clean room.
10 - Plating
Second electrolytic coating stage, where the additional coating is deposited in areas without dry film (circuit). After the copper is coated, tin is applied to protect the coated copper.
11 - Etch outer layer
This is usually a three-step process. The first step is to remove the blue dry film. The second step is to etch the exposed / unwanted copper, while the tin deposit acts as an attack resistance protecting the copper we need. The third and final step is to chemically remove the tin deposit that comes out of the circuit.
12 - External AOI layer
Assim como na AOI da camada interna, o painel gravado é escaneado para garantir que o circuito atenda ao projeto e que esteja livre de defeitos. Novamente, nenhum reparo de circuitos abertos é permitido sob as demandas do PCBWay.
13 - Soldermask
Solder mask paint is applied over the entire surface of the PCB. Using artwork and UV light, we expose certain areas to UV and unexposed areas are removed during the chemical development process - usually those areas that should be used as solderable surfaces. The remaining solder mask is then completely cured, making it a resilient finish.
This process step is performed in a clean room.
14 - Surface finish
Various finishes are applied to exposed copper areas. This is to allow surface protection and good weldability. The various finishes may include electrolytic nickel immersion gold, HASL, silver immersion etc. Thickness and weldability tests are always performed.
15 - Perfil
This is the process of cutting the manufacturing panels into specific sizes and shapes, based on the customer's design, as defined in the gerber data. There are three main options available when providing the array or selling the panel - scoring, routing or drilling. All dimensions are measured based on the customer's supplied design to ensure the panel is dimensionally correct.
16 - Electrical test
Used to check the integrity of the rails and the interconnections of the through hole - check to ensure that there are no open circuits or short circuits on the finished board. There are two test methods, the flying probe for smaller volumes and the volume-based electrical device. We electrically test each multilayer PCB against the original board data. Using a flying probe tester, we check each network to ensure that it is complete (no open circuits) and short circuited to any other network.
17 - Final inspection
In the last step of the process, a team of sharp-eyed inspectors makes a careful final check on each PCB. It checks the PCB according to the acceptance criteria and uses the "approved" PCBWay inspectors. The use of manual visual inspection and AVI - compares PCB to gerber and has a faster verification speed than human eyes, but still requires human verification. All orders are also subject to a full inspection including dimensional, weldability, etc.
18 - Packing
The boards are wrapped using materials that meet the demands of PCBWay packaging (ESD, etc.) and then packaged before shipment using the requested mode of transport.